NEW STEP BY STEP MAP FOR MONOCRYSTALLINE SILICON

Wire-noticed wafer slicing is among the critical output systems for industrial crystalline silicon PV cells, and improvements in wafer slicing technological innovation have resulted in a discount in Uncooked wafer thickness from 370 μm to a hundred and eighty μm considering that 1997 for Sharp industrial polycrystalline-silicon cells (Figure six)

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